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KIC推出KIC-HUB智慧焊接炉,王益基经理受邀EMS007现场采访播报 KIC 2016上海展， 王益基经理受邀EMS007现场采访播报，主题：KIC Smarter Oven features MES. KIC RPI 与新品EK-7完美演绎Making Ovens Smarter技术-2016上海NEPCON-Smtchina现场采访       Thermocouple Preparation In Line Package (SOIC) TC Wire Management       A Profile for Every Board Measure the wave solder process Reflow Oven Loading       Improve Batch X Ray Selection The Profiling Machine Reflow Yield Report       The oven is a profile making machine MVP – Manual Virtual Profiling Adjust A Profile To Get In Spec For Reflow       Hourly SPC Warnings Alarms Reflow Oven KIC 24-7 Product Traceability For Reflow KIC 24-7 Monitor Window Into Thermal Process       Reflow Oven Electricity Reduction Reflow Oven In Spec Reflow Oven Working Too Hard Wasting Electricity       Thermal Profiling: How to Inspect your Reflow Process Searching for the Best Oven Recipe KIC RPI Reflow Process Inspection AOI       Wave Solder — Automated Profiling KIC SMT Reflow Process Report KIC X⁵ – The World’s Most Advanced Thermal Profiler       Automatic Profiling Explained K²+ Mobile Profile Viewer Automatic AOI and X Ray       Automatic Profiling for Reflow Complement AOI and AXI with Automatic System Manual vs Auto Profiling AUTO ONLY       Manual vs Auto Profiling MANUAL ONLY Auto-Focus Power solves that oven setup puzzle Lead Free Thermal Process Window Intersection Component Solder Paste Substrate Tolerances       Oven setup for PCB components with different thermal specs Thermocouple Preparation BGA Thermocouple Attachement